Withdrawn | Published: 01/01/1989

ASTM F1260-89 Withdrawn

Test Method for Estimating Electromigration Median Time-To-Failure and Sigma of Integrated Circuit Metallizations

Available languages: English

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Detail information

Designation: ASTM F1260-89

Publication date: 01/01/1989

Pages: 7

Note: Withdrawn

Country: American technical standard

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Keywords:
Accelerated aging/testing-semiconductors, Ambient stress temperature, Current-density stress, Defects-semiconductors, Electrical conductors-semiconductors, Electromigration, Failure end point-electronic components/devices, Integrated circuits, Metallization, Microelectronic device processing, Sigma, Silicon-semiconductor applications, Stress-electronic components/devices, Temperature tests-semiconductors, Test structures, Time to failure, Voltage

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