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Active standard | Published: 24/01/2019
BS IEC 63011-2:2018
Integrated circuits. Three dimensional integrated circuits. Alignment of stacked dies having fine pitch interconnect.
Available languages: English
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Detail information
Designation: BS IEC 63011-2:2018
Publication date: 24/01/2019
Pages: 18
Country: British technical standard
Where to buy?
You can buy at www.mystandards.bizAnotation
ISBN: 978 0 580 97375 8 Status: DefinitivePopular Publishers
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