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Active standard | Published: 17/06/2022
IEC/TR 61760-3-1-ed.1.0
Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
Available languages: English
Available design: electronic design (pdf), Print design, CD-ROM
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Detail information
Designation: IEC/TR 61760-3-1-ed.1.0
Publication date: 17/06/2022
Pages: 26
Country: International technical standard
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IEC TR 61760-3-1:2022(E) supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and provides guidelines for the design of printed circuit boards with solder paste surface printing method, including specific examples.Popular Publishers
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