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Active standard | Published: 31/01/2024
IEC/TR 61760-5-1-ed.1.0
Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
Available languages: English
Available design: electronic design (pdf), Print design, CD-ROM
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Detail information
Designation: IEC/TR 61760-5-1-ed.1.0
Publication date: 31/01/2024
Pages: 24
Country: International technical standard
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IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the scope of this document.Popular Publishers
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