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Active standard | Published: 22/04/2010
IEC 62418-ed.1.0
Semiconductor devices - Metallization stress void test
(Dispositifs a semiconducteurs - Essai sur les cavites dues aux contraintes de la metallisation)
Available languages: English and French
Available design: electronic design (pdf), Print design, CD-ROM
from 170.60 USD
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Detail information
Designation: IEC 62418-ed.1.0
Publication date: 22/04/2010
Pages: 34
Country: International technical standard
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You can buy at www.mystandards.bizAnotation
IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization. La CEI 62418:2010 decrit une methode dessai sur les cavites dues aux contraintes generees par la metallisation et les criteres associes. Elle sapplique a la metallisation a laluminium (Al) ou au cuivre (Cu).Popular Publishers
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