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Active standard | Published: 20/02/2014
JIS C5630-13:2014
Semiconductor devices -- Micro-electromechanical devices -- Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
Available languages: Japanese
Available design: electronic design (pdf), Print design
from 63 193.00 CZK
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Detail information
Designation: JIS C5630-13:2014
Publication date: 20/02/2014
Pages: 12
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