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Withdrawn | Published: 01/12/1971
SAE AIR1141 Noncurrent
1992 Report on Flip Chip and Beam Lead Bonding for Electronic Circuits (Canceled)
Available languages: English
Available design: electronic design (pdf), Print design
from 143.70 USD
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Detail information
Designation: SAE AIR1141
Publication date: 01/12/1971
Pages: 0
Note: Noncurrent
Country: American technical standard
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