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Stránka 3817
Test methods for electrical materials, printed board and other interconnection structures and assemblies. General test methods for materials and assemblies. Process ionic contamination testing (PICT).
Dostupné jazyky: Anglicky
Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards.
Dostupné jazyky: Anglicky
Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené
Test methods for electrical materials, interconnection structures and assemblies. Test methods for printed board assemblies.
Dostupné jazyky: Anglicky
Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené
Test methods for electrical materials, interconnection structures and assemblies. Test methods for materials used in manufacturing electronic assemblies.
Dostupné jazyky: Anglicky
Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené
Attachment materials for electronic assembly. Requirements for soldering fluxes for high-quality interconnections in electronics assembly.
Dostupné jazyky: Anglicky
Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené
Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly.
Dostupné jazyky: Anglicky
Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications.
Dostupné jazyky: Anglicky
Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené
Tracked Changes. Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications.
Dostupné jazyky: Anglicky
Dostupné prevedenie: Elektronické PDF, Tlačené
Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies.
Dostupné jazyky: Anglicky
Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené
Tracked Changes. Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies.
Dostupné jazyky: Anglicky
Dostupné prevedenie: Elektronické PDF, Tlačené