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BS - British national standards
Page 3817
BS EN IEC 61189-5-504:2020 (17/06/2020)
Test methods for electrical materials, printed board and other interconnection structures and assemblies. General test methods for materials and assemblies. Process ionic contamination testing (PICT).
Available languages: English
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BS EN IEC 61189-5-601:2021 (19/03/2021)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards.
Available languages: English
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BS EN 61189-5:2006 (28/02/2009)
Test methods for electrical materials, interconnection structures and assemblies. Test methods for printed board assemblies.
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BS EN 61189-6:2006 (29/09/2006)
Test methods for electrical materials, interconnection structures and assemblies. Test methods for materials used in manufacturing electronic assemblies.
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BS EN 61190-1-1:2002 (16/08/2002)
Attachment materials for electronic assembly. Requirements for soldering fluxes for high-quality interconnections in electronics assembly.
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BS EN 61190-1-2:2014 (30/06/2014)
Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly.
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BS EN IEC 61190-1-3:2018 (28/03/2018)
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications.
Available languages: English
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BS EN IEC 61190-1-3:2018-TC (27/02/2020)
Tracked Changes. Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications.
Available languages: English
Available design: electronic design (pdf), Print design
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BS EN IEC 61191-1:2018 (13/11/2018)
Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies.
Available languages: English
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BS EN IEC 61191-1:2018-TC (27/02/2020)
Tracked Changes. Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies.
Available languages: English
Available design: electronic design (pdf), Print design
from 12 120.90 CZK more info
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