BS - Britische nationale Normen

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA).

Verfügbare Sprachen: Englisch

Verfügbare Ausführung: PDF - sofortiges Download, Gedruckt

Mechanical standardization of semiconductor devices. Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA).

Verfügbare Sprachen: Englisch

Verfügbare Ausführung: PDF - sofortiges Download, Gedruckt

Mechanical standardization of semiconductor devices. Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA.

Verfügbare Sprachen: Englisch

Verfügbare Ausführung: PDF - sofortiges Download, Gedruckt

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA).

Verfügbare Sprachen: Englisch

Verfügbare Ausführung: PDF - sofortiges Download, Gedruckt

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA).

Verfügbare Sprachen: Englisch

Verfügbare Ausführung: PDF - sofortiges Download, Gedruckt

Mechanical standardization of semiconductor devices. Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage.

Verfügbare Sprachen: Englisch

Verfügbare Ausführung: PDF - sofortiges Download, Gedruckt

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages.

Verfügbare Sprachen: Englisch

Verfügbare Ausführung: PDF - sofortiges Download, Gedruckt

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ).

Verfügbare Sprachen: Englisch

Verfügbare Ausführung: PDF - sofortiges Download, Gedruckt

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP).

Verfügbare Sprachen: Englisch

Verfügbare Ausführung: PDF - sofortiges Download, Gedruckt

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA).

Verfügbare Sprachen: Englisch

Verfügbare Ausführung: PDF - sofortiges Download, Gedruckt