GB - Chinese national standards

Semiconductor devices—Mechanical and climatic test methods—Part 32:Flammability of platic-encapsulated devicesexternally induced

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Semiconductor devices—Mechanical and climatic test methods—Part 33: Accelerated moisture resistance—Unbiased autoclave

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Semiconductor devices—Mechanical and climatic test methods—Part 34:Power cycling

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Semiconductor devices—Mechanical and climatic test methods—Part 35: Acoustic microscopy for plastic encapsulated electronic components

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Semiconductor devices—Mechanical and climatic test methods—Part 36:Accelerationsteady state

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Semiconductor devices—Mechanical and climatic test methods—Part 37: Board level drop test method using an accelerometer

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Semiconductor devices—Mechanical and climatic test methods—Part 38: Soft error test method for semiconductor devices with memory

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Semiconductor devices—Mechanical and climatic test methods—Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

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Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

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Available languages: English, Chinese

Available design: electronic design (pdf), Print design