IEC - International electro-technical commission

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
(Corrigendum 1 - Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 32: Inflammabilite des dispositifs a encapsulation plastique (cas d´une cause exterieure d´inflammation))

Available languages: English and French

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Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 32: Inflammabilite des dispositifs a encapsulation plastique (cas d´une cause exterieure d´inflammation))

Available languages: English and French

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Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 33: Resistance a l´humidite acceleree - Autoclave sans polarisation)

Available languages: English, Spanish, English and French

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Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module
(Dispositifs a semiconducteurs - Methodes d’essais mecaniques et climatiques - Partie 34-1: Essai de cycles en puissance pour modules de puissance a semiconducteurs)

Available languages: English and French

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Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Part 34: Cycles en puissance)

Available languages: Spanish, English and French

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Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 35: Microscopie acoustique pour composants electroniques a boitier plastique)

Available languages: English and French

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Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 36: Acceleration constante)

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Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 37: Methode d´essai de chute au niveau de la carte avec utilisation d´un accelerometre)

Available languages: English and French

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Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

Available languages: English

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Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 38: Methode d´essai des erreurs logicielles pour les dispositifs a semiconducteurs avec memoire)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM