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Testing methods of resistivity for germanium
Available languages: English, Japanese
Available design: electronic design (pdf), Print design
Testing method of resistivity for silicon crystals and silicon wafers with four-point probe
Available languages: Japanese
Available design: electronic design (pdf), Print design
Measurement of minority carrier life time in germanium by photoconductive decay method
Available languages: English, Japanese
Available design: electronic design (pdf), Print design
Measuring of minority-carrier lifetime in silicon single crystal by photoconductive decay method
Available languages: English, Japanese
Available design: electronic design (pdf), Print design
Determination of conductivity type in germanium by thermoelectromotive method
Available languages: English, Japanese
Available design: electronic design (pdf), Print design
Test methods of crystalline defects in silicon by preferential etch techniques
Available languages: English, Japanese
Available design: electronic design (pdf), Print design
Method of measurement of etch pit density of germanium crystal
Available languages: English, Japanese
Available design: electronic design (pdf), Print design
Methods of measurement of thickness, thickness variation and bow for silicon wafer
Available languages: Japanese
Available design: electronic design (pdf), Print design
Visual inspection for sliced and lapped silicon wafers
Available languages: Japanese
Available design: electronic design (pdf), Print design
Visual inspection for silicon wafers with specular surfaces
Available languages: Japanese
Available design: electronic design (pdf), Print design