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STN - Slovak standards
Page 2999
STN EN IEC 60749-21 (01/05/2026)
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Available languages: English
Available design: Print design
STN EN 60749-22 (01/01/2004)
Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength
Available languages: English
Available design: Print design
STN EN IEC 60749-22-1 (01/04/2026)
Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods
Available languages: English
Available design: Print design
STN EN IEC 60749-22-2 (01/04/2026)
Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods
Available languages: English
Available design: Print design
STN EN 60749-23 (01/10/2004)
Semiconductor devices – Mechanical and climatic test methods Part 23: High temperature operating life
Available languages: English
Available design: Print design
STN EN IEC 60749-23 (01/05/2026)
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
Available languages: English
Available design: Print design
STN EN 60749-23:2004/A1 (01/06/2011) Change
Semiconductor devices – Mechanical and climatic test methods Part 23: High temperature operating life
Available languages: English
Available design: Print design
STN EN 60749-24 (01/10/2004)
Semiconductor devices – Mechanical and climatic test methods Part 24: Accelerated moisture resistance – Unbiased HAST
Available languages: English
Available design: Print design
STN EN IEC 60749-24 (01/04/2026)
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
Available languages: English
Available design: Print design
STN EN 60749-25 (01/03/2004)
Semiconductor devices - Mechanical and climatic test methods Part 25: Temperature cycling
Available languages: English
Available design: Print design
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