ČSN - Czech national standards

Polovodičové součástky - Mechanické a klimatické zkoušky - Část 20-1: Manipulace, balení, značení a přeprava povrchově montovaných součástek citlivých na společné působení vlhkosti a tepla při pájení.

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Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

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Polovodičové součástky - Mechanické a klimatické zkoušky - Část 21: Pájitelnost.

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Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

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Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

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Polovodičové součástky - Mechanické a klimatické zkoušky - Část 22: Pevnost spoje.

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Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods

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Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods

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Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

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Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

Available languages: English (the title page in Czech only)

Available design: Print design