ČSN - Czech national standards

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

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Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

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Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

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Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation

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Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)

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Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

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Polovodičové součástky - Mechanické a klimatické zkoušky - Část 19: Zkouška pevnosti čipu střihem. (Norma přebírající anglický originál, vlastní text je součástí výtisku).

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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

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Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount device sensitive to the combined effect of moisture and soldering heat

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Polovodičové součástky - Mechanické a klimatické zkoušky - Část 20-1: Manipulace, balení, značení a přeprava povrchově montovaných součástek citlivých na společné působení vlhkosti a tepla při pájení. (Norma přebírající anglický originál, vlastní text je součástí výtisku).

Available languages: English (the title page in Czech only)

Available design: Print design