IEC - International electro-technical commission

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
(Materiaux de fixation pour les assemblages electroniques - Partie 1-2: Exigences relatives aux pates a braser pour les interconnexions de haute qualite dans les assemblages de composants electroniques)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
(Materiaux de fixation pour les assemblages electroniques - Partie 1-3: Exigences relatives aux alliages a braser de categorie electronique et brasure solide fluxee et non-fluxee pour les applications de brasage electronique)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
(Ensembles de cartes imprimees - Partie 1: Specification generique - Exigences relatives aux ensembles electriques et electroniques brases utilisant les techniques de montage en surface et associees)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Available languages: English

Available design: electronic design (pdf), Print design, CD-ROM

Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies

Available languages: English

Available design: electronic design (pdf), Print design, CD-ROM

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
(Ensembles de cartes imprimees - Partie 2: Specification intermediaire - Exigences relatives a l´assemblage par brasage pour montage en surface)

Available languages: English, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Available languages: English, English and French

Available design: electronic design (pdf), CD-ROM, Print design

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
(Ensembles de cartes imprimees - Partie 3: Specification intermediaire - Exigences relatives a l´assemblage par brasage de trous traversants)

Available languages: English, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
(Ensembles de cartes imprimees – Partie 4: Specification intermediaire – Exigences relatives a l’assemblage de bornes par brasage)

Available languages: English, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
(Ensembles de cartes imprimees - Partie 6: Criteres d´evaluation des vides dans les joints brases des boitiers BGA et LGA et methode de mesure)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM