IEC - International electro-technical commission

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 5-5: Considerations sur les liaisons pistes-soudures - Composants a sorties en aile de mouette sur quatre cotes)

Available languages: English, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 5-6: Considerations sur les liaisons pistes-soudures - Composants a sorties en J sur quatre cotes)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 5-8: Considerations sur les liaisons pastilles/joints - Composants matriciels (BGA, FBGA, CGA, LGA))

Available languages: English, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 6-1: Conception de la zone de report - Exigences generiques pour la zone de report sur les cartes imprimees)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 6-2: Conception de la zone de report - Description de la zone de report pour les composants montes en surface (CMS) les plus courants)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 6-3: Conception de la zone de report - Description de la zone de report pour les composants a trous traversants (THT))

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 6-4: Conception de la zone de report - Exigences generiques pour les dessins dimensionnels de composants montes en surface (CMS) du point de vue de la conception de la zone de report)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 7: Orientation nulle des composants electroniques pour l´elaboration d’une bibliotheque CAO)

Available languages: English, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library

Available languages: English

Available design: electronic design (pdf), Print design, CD-ROM

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
(Methodes d´essais pour les materiaux electriques, les structures d´interconnexion et les ensembles - Partie 1: Methodes d´essai generales et methodologie)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM