IEC - International electro-technical commission

Safety of machinery - Application of protective equipment to detect the presence of persons
(Securite des machines - Application des equipements de protection a la detection de la presence de personnes)

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Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
(Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 1: Termes et definitions)

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Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
(Dispositifs a semiconducteur - Dispositifs microelectromecaniques - Partie 10: Essai de compression utilisant la technique des micro-piliers pour les materiaux des MEMS)

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Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
(Corrigendum 1 - Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 10: Essai de compression utilisant la technique des micro-piliers pour les materiaux des MEMS)

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Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
(Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 11: Methode d´essai pour les coefficients de dilatation thermique lineaire des materiaux autonomes pour systemes microelectromecaniques)

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Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
(Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 12: Methode d´essai de fatigue en flexion des materiaux en couche mince utilisant les vibrations a la resonance des structures a systemes microelectromecaniques (MEMS))

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Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
(Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 13: Methodes d´essais de types courbure et cisaillement de mesure de la resistance d´adherence pour les structures MEMS)

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Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
(Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 14: Methode de mesure des limites de formage des materiaux a couche metallique)

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Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
(Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 16: Methodes d´essai pour determiner les contraintes residuelles des films de MEMS - Methodes de la courbure de la plaquette et de deviation de poutre en porte-a-faux)

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Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
(Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 17: Methode d´essai de renflement pour la mesure des proprietes mecaniques des couches minces)

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