STN - Slovak standards

Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits

Available languages: English

Available design: Print design

Normalizácia rozmerov polovodičových súčiastok. Časť 4: Systém kódovania a triedenia podľa tvaru puzdier polovodičových súčiastok (Norma na priame používanie ako STN). (Norma sa môže používať bez zmeny A1 do 1.5.2021).

Available languages: English

Available design: Print design

Normalizácia rozmerov polovodičových súčiastok. Časť 4: Systém kódovania a triedenia podľa tvaru puzdier polovodičových súčiastok (Norma na priame používanie ako STN).

Available languages: English

Available design: Print design

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

Available languages: English

Available design: Print design

Mechanical standardization of semiconductor devices Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals

Available languages: English

Available design: Print design

Mechanical standardization of semiconductor devices. Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Available languages: English

Available design: Print design

Mechanical standardization of semiconductor devices. Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of quad flat packs (QFP)

Available languages: English

Available design: Print design

Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Available languages: English

Available design: Print design

Mechanical standardization of semiconductor devices. Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitch ball grid array (FBGA)

Available languages: English

Available design: Print design

Mechanical standardization of semiconductor devices. Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine pitch land grid array (FLGA)

Available languages: English

Available design: Print design