ČSN - Czech national standards

Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes

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Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson´s ratio of thin film MEMS materials

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Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

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Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

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Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures

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Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices

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Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

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Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass

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Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements

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