ČSN - Czech national standards

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

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Polovodičové součástky - Mikroelektromechanické součástky - Část 10: Zkouška tlakem mikrosloupku pro materiály MEMS. (Norma přebírající anglický originál, vlastní text je součástí výtisku).

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Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

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Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

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Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures

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Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials

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Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

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Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

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Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

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Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses

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