IEC - International electro-technical commission

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
(Normalisation mecanique des dispositifs a semiconducteurs - Partie 6-3: Regles generales pour la preparation des dessins d´encombrement des dispositifs a semiconducteurs a montage en surface - Methodes de mesure pour les boitiers plats quadrangulaires (QFP))

Available languages: English, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
(Normalisation mecanique des dispositifs a semiconducteurs - Partie 6-4: Regles generales pour la preparation des dessins d´encombrement des dispositifs a semiconducteurs a montage en surface - Methodes de mesure pour les dimensions des boitiers matriciels a billes (BGA))

Available languages: English, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Available languages: English, Spanish

Available design: electronic design (pdf), Print design, CD-ROM

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
(Normalisation mecanique des dispositifs a semiconducteurs - Partie 6-6: Regles generales pour la preparation des dessins d´encombrement des dispositifs a semiconducteurs a montage en surface - Guide de conception des dispositifs FLGA)

Available languages: English, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
(Normalisation mecanique des dispositifs a semiconducteurs - Partie 6-8: Regles generales pour la preparation des dessins d´encombrement des dispositifs a semiconducteurs a montage en surface - Guide de conception pour les boitiers plats quadrangulaires en ceramique, scellement verre (G-QFP))

Available languages: English, Spanish, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
(Normalisation mecanique des dispositifs a semi-conducteurs - Partie 6: Regles generales pour la preparation des dessins d´encombrement des boitiers pour dispositifs a semi-conducteurs pour montage en surface)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Low-pressure sodium vapour lamps - Performance specifications
(Lampes a vapeur de sodium a basse pression - Prescriptions de performance)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Hydraulic turbines, storage pumps and pump-turbines - Model acceptance tests
(Turbines hydrauliques, pompes d´accumulation et pompes-turbines - Essais de reception sur modele)

Available languages: English and French

Available design: electronic design (pdf), CD-ROM

Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
(Conception, fabrication et assemblage de cartes imprimees - Vocabulaire - Partie 1: Usage commun des techniques d’assemblage des composants electroniques et des cartes imprimees)

Available languages: English and French

Available design: electronic design (pdf), CD-ROM

Electronic assembly, design and circuit boards - Vocabulary - Part 2: Common usage in electronic technologies as well as electronic assembly technologies

Available languages: English

Available design: electronic design (pdf), Print design, CD-ROM