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BS - British national standards
Page 4014
BS EN 62047-10:2011 (30/09/2011)
Semiconductor devices. Micro-electromechanical devices. Micro-pillar compression test for MEMS materials.
Available languages: English
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BS EN 62047-11:2013 (31/10/2013)
Semiconductor devices. Micro-electromechanical devices. Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems.
Available languages: English
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BS EN 62047-12:2011 (30/11/2011)
Semiconductor devices. Micro-electromechanical devices. Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures.
Available languages: English
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BS EN 62047-13:2012 (31/05/2012)
Semiconductor devices. Micro-electromechanical devices. Bend-and shear-type test methods of measuring adhesive strength for MEMS structures.
Available languages: English
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BS EN 62047-14:2012 (31/05/2012)
Semiconductor devices. Micro-electromechanical devices. Forming limit measuring method of metallic film materials.
Available languages: English
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BS EN 62047-15:2015 (31/07/2015)
Semiconductor devices. Micro-electromechanical devices. Test method of bonding strength between PDMS and glass.
Available languages: English
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BS EN 62047-16:2015 (31/07/2015)
Semiconductor devices. Micro-electromechanical devices. Test methods for determining residual stresses of MEMS films. Wafer curvature and cantilever beam deflection methods.
Available languages: English
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BS EN 62047-17:2015 (31/07/2015)
Semiconductor devices. Micro-electromechanical devices. Bulge test method for measuring mechanical properties of thin films.
Available languages: English
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BS EN 62047-18:2013 (31/10/2013)
Semiconductor devices. Micro-electromechanical devices. Bend testing methods of thin film materials.
Available languages: English
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BS EN 62047-19:2013 (31/10/2013)
Semiconductor devices. Micro-electromechanical devices. Electronic compasses.
Available languages: English
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